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The three steps in the rework process for surface-mount technology are as follows First, there is removal of the defective part The component removal step subjects the circuit board to the first of three solder reflow cycles Different heat source methods are available to address the variety of package I/O configurations (eg, leadless, gull-wing leads, etc) The removal of the defective component, particularly high I/O fine-pitch leaded and area-array packages, is best done when all of the solder joints are simultaneously molten to prevent damage to the more fragile Cu pads Soldering tweezers are used to melt both solder joints of chip resistors, capacitors, inductors, or diodes The tweezers are then used to pull the component quickly from the site.

The hot solder bar tip is used to melt, simultaneously, all of the solder joints in along a row as may be required for peripheral leaded packages, such as gull-wing leaded and J-leaded packages Hot air or hot gas (nitrogen) has been used to reflow, simultaneously, all solder joints of fine-pitch (high I/O count), peripheral leaded packages (eg, QFPs) as well as those of areaarray packages that include BGA components, CSPs, and FC components An example of a hot-gas nozzle applied to a BGA package is shown in Fig 4031 Control of the hot-air flow maximizes heat delivery to the solder joints and minimizes the temperature rise in the component body The shroud also limits the exposure of neighboring devices and their solder joints to elevated temperatures.

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Unfortunately, unlike with one or two solder joints, it is not always possible for an operator to sense the presence of a few unmelted solder joints among the several hundreds or thousands of small interconnections on a fine-pitch peripherally leaded or BGA packageThe consequence is damage to the Cu pad, which must then be repaired if possible Under these circumstances, rework stations have become invaluable Vacuum pickups or finger mechanisms attach to the component and then pull on in it with only enough force to release it from the circuit when all of the solder joints are molten, thereby preventing damage to the pads Once the defective component has been removed from the circuit board, the second step is to remove excess solder from the Cu pads This step is also referred to as dressing the pads.

Remaining solder bumps and spikes interfere with the placement of the new component More importantly, excess residual solder, the quantity of which is not tightly controlled, causes variability to the replacement component s solder joints, which can lead to possible opens, shorts, or a loss of long-term reliability Because the cleaning or dressing step requires a solder reflow heat cycle (the second of three), the time-temperature profile of that cycle must be.

50 04

FIGURE 40.31 A hot-air shroud that is used to simultaneously reflow all of the solder joints on a BGA package. (Courtesy of OK International.)

minimized to prevent damage to the more fragile Cu bond pads and nearby traces as well as to the laminate itself This procedure is typically performed manually The third step in the rework process is the assembly of the new component to the circuit board Here, the circuit board site is exposed to the third of three solder reflow cycles Also, it is at this point that semiautomated or automated rework capabilities can be particularly advantageous when compared to a manual operation First, there is the step of providing solder to the joint pads The presence of other components precludes the use of stencil or screenprinting dispensing techniques Although solder preforms are a viable approach for components of larger I/Os, the most versatile and repeatable method for surface-mount components is dispensing paste through a syringe This method may be performed manually when the number of I/O are relatively small.

3 (OUTPUT)

However, for particularly small passive components, fine-pitch peripheral leaded packages, and area-array devices, automated solder paste dispensing is the preferred technique to control both position and paste quantity In the case of some BGA and DCA/FC components, there may not be the need for additional solder Only a flux is dispensed on the Cu pads prior to the component placement step The tackiness of the flux anchors the part in place prior to reflow soldering Next, the new component is placed on the circuit board The extent of rework placement automation depends on the mix of components Specific variables include the package type (a passive chip device, a QFP with leads, an area-array package, etc); the package size and its fragility, which determine handling requirements; and the number and pitch of the interconnections.

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